Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27505E25F35BC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27505E25F35BC | |
| Related Links | MS27505, MS27505E25F35BC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | CRCW120612K0FKEA | RES SMD 12K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | MC14073BDR2G | IC GATE AND 3CH 3-INP 14-SOIC | datasheet.pdf | |
![]() | 0603ZG224ZAT2A | CAP CER 0.22UF 10V Y5V 0603 | datasheet.pdf | |
![]() | 0395026505 | TERM BLOCK HDR 5POS R/A 3.5MM | datasheet.pdf | |
![]() | RN60C1783BB14 | RES 178K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | 1410-L110-L1F1-S01-0.8A | CIR BRKR THRM 800MA 250VAC 50VDC | datasheet.pdf | |
| 502LAC-ADAF | OSC PROG 1.8V 1.3NS 50PPM 2X2.5 | datasheet.pdf | ||
![]() | 30-3503-21 | CONN IC DIP SOCKET 30POS GOLD | datasheet.pdf | |
![]() | ATS-17D-30-C2-R0 | HEATSINK 70X70X25MM XCUT T766 | datasheet.pdf | |
![]() | MBB02070C5768DC100 | RES 5.76 OHM 0.6W 0.5% AXIAL | datasheet.pdf | |
![]() | EK60BV060 | BEVEL 6.00MM | datasheet.pdf | |
![]() | BFC237327564 | CAP FILM 560NF 10% 100VDC RAD | datasheet.pdf |