Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT18HTF25672FY-667A5D3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 100 | |
| Category | Memory Cards, Modules | |
| Family | Memory - Modules | |
| Series | - | |
| Memory Type | DDR2 SDRAM | |
| Memory Size | 2GB | |
| Speed | 667MT/s | |
| Package / Case | 240-FBDIMM | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT18HTF25672FY-667A5D3 | |
| Related Links | MT18HTF2567, MT18HTF25672FY-667A5D3 Datasheet, Micron Technology Distributor | |
![]() | 27112 | BOARD BASIC STAMP 1 PROJECT | datasheet.pdf | |
![]() | LT1396CMS8#TRPBF | IC OPAMP CFA 400MHZ 8MSOP | datasheet.pdf | |
![]() | 3218JH3 | FAN AXIAL 92X38MM 48VDC WIRE | datasheet.pdf | |
![]() | MCIMX356AJQ5CR2 | IC MPU I.MX35 532MHZ 400MAPBGA | datasheet.pdf | |
![]() | 6086493-1 | CONN SMA JACK STR 50 OHM SOLDER | datasheet.pdf | |
![]() | F56202109 | POS TRANS-XDCR SLW 50 MM | datasheet.pdf | |
![]() | ATS-16B-130-C3-R0 | HEATSINK 60X60X15MM XCUT T412 | datasheet.pdf | |
![]() | 2143019-2 | IMP100,S,H,RA2P10C,RG,LEW39 | datasheet.pdf | |
![]() | IRG7PH46UD-EP | IGBT 1200V 108A COPAK247 | datasheet.pdf | |
![]() | L77SDEH09SVF | D-Sub Connector Receptacle, Female Sockets 9 Position Free Hanging (In-Line) Solder | datasheet.pdf | |
![]() | PL138-48OI-R | IC CLK BUFFER 2:4 1GHZ 20TSSOP | datasheet.pdf | |
![]() | 863995-1 | END BELL | datasheet.pdf |