Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT18LSDT6472Y-13EG1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 06/Jan/2014 | |
| Standard Package | 100 | |
| Category | Memory Cards, Modules | |
| Family | Memory - Modules | |
| Series | - | |
| Memory Type | SDRAM | |
| Memory Size | 512MB | |
| Speed | 133MHz | |
| Package / Case | 168-RDIMM | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT18LSDT6472Y-13EG1 | |
| Related Links | MT18LSDT6, MT18LSDT6472Y-13EG1 Datasheet, Micron Technology Distributor | |
![]() | RBM06DTAT | CONN EDGECARD 12POS R/A .156 SLD | datasheet.pdf | |
![]() | 06035A561KAT2A | CAP CER 560PF 50V NP0 0603 | datasheet.pdf | |
![]() | CY7C1413KV18-250BZC | IC SRAM 36MBIT 250MHZ 165FBGA | datasheet.pdf | |
![]() | RWR80N15R0FSBSL | RES 15 OHM 2W 1% WW AXIAL | datasheet.pdf | |
![]() | APA1000-FGG896M | IC FPGA 642 I/O 896FBGA | datasheet.pdf | |
![]() | 161-64112 | 1/4"HELA WRAP POLY COVER 100' | datasheet.pdf | |
![]() | ATS-20H-76-C1-R0 | HEATSINK 25X25X25MM R-TAB | datasheet.pdf | |
![]() | ATS-06B-146-C3-R0 | HEATSINK 30X30X35MM L-TAB T412 | datasheet.pdf | |
![]() | ACZRM5260B-HF | DIODE ZENER 43V 500MW SOD123FL | datasheet.pdf | |
![]() | 61684-5 | CONN TAB | datasheet.pdf | |
![]() | GSB-01 | BOX PLASTIC BLK 2.56"L X 2.36"W | datasheet.pdf | |
![]() | 407DCN2R7K | CAP 400F 10% 2.7V T/H | datasheet.pdf |