Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT29F32G08CBACAL73A3WC1P | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Bulk | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NAND | |
| Memory Size | 32G (4G x 8) | |
| Speed | - | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | Die | |
| Supplier Device Package | Die | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT29F32G08CBACAL73A3WC1P | |
| Related Links | MT29F32G08CB, MT29F32G08CBACAL73A3WC1P Datasheet, Micron Technology Distributor | |
![]() | XC3042A-7VQ100C | IC FPGA 82 I/O 100VQFP | datasheet.pdf | |
![]() | C8051F061 | IC 8051 MCU 64K FLASH 64TQFP | datasheet.pdf | |
![]() | Z8F0831HH020EG | IC ENCORE XP MCU FLASH 8K 20SSOP | datasheet.pdf | |
![]() | CWT-OSK-PROJB-LX | TECH SUPPORT OSEK PROJECT B | datasheet.pdf | |
![]() | CY7C1360S-166BZC | IC SRAM 9MBIT 166MHZ 165FBGA | datasheet.pdf | |
![]() | RNC50J56R2FSB14 | RES 56.2 OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | RWR89N1500FSBSL | RES 150 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | PSE-6M-19 | BRD SPT SNAP LOCK REST MNT 6MM | datasheet.pdf | |
![]() | 510-87-299-20-001101 | CONN SOCKET PGA 299POS GOLD | datasheet.pdf | |
![]() | SG-636PTF 16.5800MC3: ROHS | OSC XO 16.58MHZ CMOS, TTL SMD | datasheet.pdf | |
![]() | SIT9002AC-33N33SG | OSC MEMS PROG | datasheet.pdf | |
![]() | 36DX782F250DF2A | 7800UF 250V 76X143 85C ST | datasheet.pdf |