Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MT47H128M8CF-187E:H TR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 04/Feb/2014 Updated LTB Date Revision 17/Jun/2014 | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | DDR2 SDRAM | |
| Memory Size | 1G (128M x 8) | |
| Speed | 1.875ns | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.9 V | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 60-TFBGA | |
| Supplier Device Package | 60-FBGA (8x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MT47H128M8CF-187E:H TR | |
| Related Links | MT47H128M8C, MT47H128M8CF-187E:H TR Datasheet, Micron Technology Distributor | |
![]() | C2012X7R2E222K085AA | CAP CER 2200PF 250V X7R 0805 | datasheet.pdf | |
![]() | ATS-50330B-C1-R0 | HEAT SINK 33MM X 33MM X 7.5MM | datasheet.pdf | |
![]() | GBM36DTBD-S273 | CONN EDGECARD 72POS R/A .156 SLD | datasheet.pdf | |
![]() | VE-2NM-IU | CONVERTER MOD DC/DC 10V 200W | datasheet.pdf | |
![]() | RNC50H1102FRB14 | RES 11K OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | CMF60475R00FHR6 | RES 475 OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | CMF5547R000JKR6 | RES 47 OHM 1/2W 5% AXIAL | datasheet.pdf | |
![]() | PSA.5S.322.ZLLZ | INSERT PSA.5S.322. FOR 22LV | datasheet.pdf | |
![]() | EP20K100EBC356-1X | IC FPGA 246 I/O 356BGA | datasheet.pdf | |
![]() | AP105-GT1-1P-30/F5C-ID(61 | TOOL APPLICATOR GT1 ACCESSORY | datasheet.pdf | |
![]() | ATS-11H-72-C2-R0 | HEATSINK 45X45X35MM L-TAB T766 | datasheet.pdf | |
![]() | D38999/20WE99JN-LC | CONN HSG RCPT FLANGE 23POS SKT | datasheet.pdf |