Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MX29GL256FDXFI-11G | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | MX29GLxxxF Migrating From MX29GLxxxP | |
| Standard Package | 144 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | MX29GL | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 256M (32M x 8) | |
| Speed | 110ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-LBGA, CSPBGA | |
| Supplier Device Package | 64-LFBGA, CSP (11x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MX29GL256FDXFI-11G | |
| Related Links | MX29GL256, MX29GL256FDXFI-11G Datasheet, Macronix Distributor | |
![]() | TSW-130-06-G-S | CONN HEADER 30POS .100" SGL GOLD | datasheet.pdf | |
| RSMF1FB10K0 | RES MO 1W 10K OHM 1% AXIAL | datasheet.pdf | ||
![]() | CF2JT2K20 | RES 2.2K OHM 2W 5% CARBON FILM | datasheet.pdf | |
![]() | 70V24S15PF8 | IC SRAM 64KBIT 15NS 100TQFP | datasheet.pdf | |
![]() | UNR921CG0L | TRANS PREBIAS NPN 125MW SSMINI3 | datasheet.pdf | |
![]() | ATS-55230W-C0-R0 | HEATSINK 23X23X24.5MM W/OUT TIM | datasheet.pdf | |
![]() | AFD57-24-31PY-6141 | CONN HSG PLUG STRGHT 31POS PIN | datasheet.pdf | |
![]() | B43504B9337M62 | CAP ALUM 330UF 20% 400V SNAP | datasheet.pdf | |
![]() | LM4132DMFX-3.3 | IC VREF SERIES 3.3V SOT23-5 | datasheet.pdf | |
![]() | ATS-04C-122-C3-R0 | HEATSINK 50X50X15MM XCUT T412 | datasheet.pdf | |
![]() | 4420P-1-103LF | RES ARRAY 10 RES 10K OHM 20SOIC | datasheet.pdf | |
![]() | BFC233926224 | CAP FILM 220NF 20% 310VAC RAD | datasheet.pdf |