Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-N25Q256A11EF840E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | MX25L25635F Migrating from N25Q256A | |
| Standard Package | 320 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 256M (64Mx4) | |
| Speed | 108MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 1.7 V ~ 2 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 8-VDFN Exposed Pad | |
| Supplier Device Package | 8-VDFPN (MLP8) (8x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | N25Q256A11EF840E | |
| Related Links | N25Q256A, N25Q256A11EF840E Datasheet, Micron Technology Distributor | |
![]() | 1894 | HEX STANDOFF 4-40 ALUMINUM 5/8" | datasheet.pdf | |
![]() | PI49FCT20802QE | IC CLK BUFFER 1:5 150MHZ 16QSOP | datasheet.pdf | |
![]() | CRCW120622K0JNTA | RES SMD 22K OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | EBM06DRSD-S273 | CONN EDGECARD 12POS DIP .156 SLD | datasheet.pdf | |
![]() | ERA-3AEB1401V | RES SMD 1.4K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 7448709220 | INDUCT ARRAY 2 COIL 22UH SMD | datasheet.pdf | |
![]() | RNC55H6121BSBSL | RES 6.12K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | PPT2-0020DXG2VS | PRESSURE TRANSDUCER | datasheet.pdf | |
![]() | SMPZ3919B-M3/85A | DIODE ZENER 5.6V 500MW DO220AA | datasheet.pdf | |
![]() | YK50211130J0G | Connector Barrier Block Strip 11 Circuit 0.374" (9.50mm) | datasheet.pdf | |
![]() | VJ0805D3R6BLAAP | CAP CER 3.6PF 50V NP0 0805 | datasheet.pdf | |
![]() | 155CKR050M | CAP ALUM 1.5UF 20% 50V THRU HOLE | datasheet.pdf |