Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-OMAPL138BZWTA3R | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Freon/Netra/SubArtic EOL 06/Oct/2015 Freon/Netra/SubArtic EOL Update 4/Nov/2015 | |
| PCN Design/Specification | Hybrid Au/Cu Wire Bond Flow 08/Apr/2014 Multiple Changes Revision B 23/Jun/2014 | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | OMAP-L1x | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | ARM926EJ-S | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 375MHz | |
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | |
| RAM Controllers | SDRAM | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | LCD | |
| Ethernet | 10/100 Mbps (1) | |
| SATA | SATA 3Gbps (1) | |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | |
| Voltage - I/O | 1.8V, 3.3V | |
| Operating Temperature | -40°C ~ 105°C | |
| Security Features | Boot Security, Cryptography | |
| Package / Case | 361-LFBGA | |
| Supplier Device Package | 361-NFBGA (16x16) | |
| Additional Interfaces | HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | OMAPL138BZWTA3R | |
| Related Links | OMAPL13, OMAPL138BZWTA3R Datasheet, Texas Instruments Distributor | |
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