Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-OTH-Q81771C-00-DN5 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tpcm™ 580 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 10.00mm x 10.00mm | |
| Thickness | 0.008" (0.203mm) | |
| Material | Phase Change Compound | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | - | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 3.8 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | OTH-Q81771C-00-DN5 | |
| Related Links | OTH-Q8177, OTH-Q81771C-00-DN5 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | CW201212-68NJ | FIXED IND 68NH 500MA 270 MOHM | datasheet.pdf | |
![]() | AD602AR-REEL | IC OPAMP VGA 35MHZ 16SOIC | datasheet.pdf | |
![]() | DS1392U-33+ | IC RTC CLK/CALENDAR SER 10-USOP | datasheet.pdf | |
![]() | EMM12DRSN-S273 | CONN EDGECARD 24POS DIP .156 SLD | datasheet.pdf | |
![]() | 50015-1192D | 4 ROW VERTICAL HEADER SOLDER | datasheet.pdf | |
![]() | HDSP-C5L3 | DISPLAY 0.52 SGL DGT CC ORN TH | datasheet.pdf | |
![]() | D38999/20FD35JE | CONN RCPT 37POS FLANGE W/SKT | datasheet.pdf | |
![]() | DJT10E15-5PN | CONN RCPT 5POS FLANGE W/PINS | datasheet.pdf | |
![]() | R5F21331CDFP#50 | IC MCU 16BIT 4KB FLASH 32LQFP | datasheet.pdf | |
![]() | XC6108C22CGR-G | IC SUPERVISOR 2.2V 4-USP | datasheet.pdf | |
![]() | JBXFD1A03MSSDSR | CONN PLUG 3P INLINE PIN SLD CUP | datasheet.pdf | |
![]() | NLFV32T-3R3M-EFT | FIXED IND 3.3UH 420MA 132 MOHM | datasheet.pdf |