Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-P50-050PG-S1-TGF | |
| Lead Free Status / RoHS Status | Vendor undefined / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Interconnect Mating Guide | |
| Standard Package | 209 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | Pak 50, P50 | |
| Packaging | Bulk | |
| Connector Type | Plug, Center Strip Contacts | |
| Number of Positions | 50 | |
| Pitch | 0.050" (1.27mm) | |
| Number of Rows | 2 | |
| Mounting Type | Through Hole | |
| Features | Ground Pin | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 2µin (0.05µm) | |
| Mated Stacking Heights | - | |
| Height Above Board | 0.461" (11.70mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | P50-050PG-S1-TGF | |
| Related Links | P50-050P, P50-050PG-S1-TGF Datasheet, 3M Distributor | |
![]() | 0273.300H | FUSE BOARD MNT 300MA 125VAC/VDC | datasheet.pdf | |
![]() | 2306 326 55169 | RES SMD 16 OHM 5% 3W Z BEND | datasheet.pdf | |
![]() | TLV5614IDG4 | IC 12-BIT QUAD SER DAC 16-SOIC | datasheet.pdf | |
![]() | RMCF2010FTR470 | RES SMD 0.47 OHM 1% 3/4W 2010 | datasheet.pdf | |
![]() | C0603C101J8GACTU | CAP CER 100PF 10V NP0 0603 | datasheet.pdf | |
![]() | RWR81S2R67FSS70 | RES 2.67 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | RER75F13R0RCSL | RES CHAS MNT 13 OHM 1% 30W | datasheet.pdf | |
![]() | 3057P-1-501M | TRIMMER 500 OHM 1W PC PIN | datasheet.pdf | |
![]() | 8N4DV85AC-0176CDI8 | IC OSC VCXO DUAL FREQ 6-CLCC | datasheet.pdf | |
![]() | H4X-06BHD | HANDLE SUPPORT BRACKET | datasheet.pdf | |
![]() | D38999/24WB98HB-LC | CONN HSG RCPT JAM NUT 6POS PIN | datasheet.pdf | |
![]() | 1880 | Capacitors Inductors Filters... | datasheet.pdf |