Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-P50-200S-R1-EA | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Interconnect Mating Guide | |
| Standard Package | 201 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | Pak 50, P50 | |
| Packaging | Bulk | |
| Connector Type | Socket, Outer Shroud Contacts | |
| Number of Positions | 200 | |
| Pitch | 0.050" (1.27mm) | |
| Number of Rows | 2 | |
| Mounting Type | Through Hole | |
| Features | Board Lock, Flange | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 10µin (0.25µm) | |
| Mated Stacking Heights | - | |
| Height Above Board | 0.421" (10.70mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | P50-200S-R1-EA | |
| Related Links | P50-200, P50-200S-R1-EA Datasheet, 3M Distributor | |
![]() | CR3002AA | TVS DIODE 140VWM TO220 | datasheet.pdf | |
![]() | 3750-8 | BINDING POST GOLD PLATED GRAY | datasheet.pdf | |
![]() | RG1005N-2321-B-T5 | RES SMD 2.32KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | ESA06DRMN | CONN EDGECARD 12POS .125 SQ WW | datasheet.pdf | |
![]() | C1206C331JBGACTU | CAP CER 330PF 630V NP0 1206 | datasheet.pdf | |
![]() | A3P250L-FG256I | IC FPGA 157 I/O 256FBGA | datasheet.pdf | |
![]() | RNC60J1542FSB14 | RES 15.4K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | RWR84S6491FMB12 | RES 6.49K OHM 7W 1% WW AXIAL | datasheet.pdf | |
![]() | 500RDP3S1M6RE | SWITCH SLIDE DPDT 0.4VA 20V | datasheet.pdf | |
![]() | 0761551325 | IMPACT BP 4X6 DUAL WALL SN | datasheet.pdf | |
![]() | 1460314 | CONN HOOD CPLNG BOTTOM SZB16 | datasheet.pdf | |
![]() | T37065-21-0 | Connector Barrier Block Strip 21 Circuit 0.375" (9.53mm) | datasheet.pdf |