NXP Semiconductors/Freescale Semiconductor, Inc. P80C32SBPN,112
- Mfg. Part Number
- P80C32SBPN,112
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC 80C51 MCU 256X8 ROMLESS 40DIP
- Datasheet Download
- P80C32SBPN,112.pdf
Availability of P80C32SBPN,112
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of P80C32SBPN,112, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. P80C32SBPN,112 can be shipped within 24 hours after order. If you have any demands for P80C32SBPN,112, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- P80C32SBPN,112 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
P80C32SBPN,112
| Internal Part Number | EIS-P80C32SBPN,112 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Migrating from 8/16-Bit MCUs to 32-Bit ARMs | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 01/Jul/2014 MCU Dip Supply Situation 12/May/2015 | |
| PCN Design/Specification | Plating Process DIP Packages 16/Sep/2013 | |
| PCN Packaging | Date Code Extended 18/Jul/2013 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 9 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | 80C | |
| Packaging | Tube | |
| Core Processor | 8051 | |
| Core Size | 8-Bit | |
| Speed | 16MHz | |
| Connectivity | UART/USART | |
| Peripherals | POR | |
| Number of I/O | 32 | |
| Program Memory Size | - | |
| Program Memory Type | ROMless | |
| EEPROM Size | - | |
| RAM Size | 256 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | - | |
| Oscillator Type | Internal | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 40-DIP (0.600", 15.24mm) | |
| Supplier Device Package | 40-DIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | P80C32SBPN,112 | |
| Related Links | P80C32S, P80C32SBPN,112 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
P80C32SBPN,112 Details Description
Related parts for P80C32SBPN,112
 | TPS2010AD | IC 0.3A PWR DIST SWITCH 8-SOIC | datasheet.pdf | |
 | Z8F022AHH020EG | IC ENCORE XP MCU FLASH 2K 20SSOP | datasheet.pdf | |
 | EEC18DRTH-S13 | CONN EDGECARD 36POS .100 EXTEND | datasheet.pdf | |
| VE-26V-CX-F1 | CONVERTER MOD DC/DC 5.8V 75W | datasheet.pdf | |
 | RCL1225287KFKEG | RES SMD 287K OHM 2W 2512 WIDE | datasheet.pdf | |
| 7789677015 | PAC-UNIV-HE10-V0-1.5M | datasheet.pdf | |
| A-2014-0-1 | CONN MOD JACK 6P4C VERT UNSHLD | datasheet.pdf | |
| ATS-10G-95-C3-R0 | HEATSINK 40X40X30MM R-TAB T412 | datasheet.pdf | |
| ATS-02H-29-C2-R0 | HEATSINK 70X70X20MM XCUT T766 | datasheet.pdf | |
| OQ053500D0J0G | 381 TB SOCKET VER SMT | datasheet.pdf | |
| 10118650-406007LF | HEADER BERGSTIK STR | datasheet.pdf | |
| 202F211-51-0-CS5326 | BLOW-MOLDED PARTS | datasheet.pdf |