Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-P87LPC767FN,112 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Migrating from 8/16-Bit MCUs to 32-Bit ARMs | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 01/Jul/2014 MCU Dip Supply Situation 12/May/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 18 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | LPC700 | |
| Packaging | Tube | |
| Core Processor | 8051 | |
| Core Size | 8-Bit | |
| Speed | 20MHz | |
| Connectivity | I²C, UART/USART | |
| Peripherals | Brown-out Detect/Reset, LED, POR, WDT | |
| Number of I/O | 18 | |
| Program Memory Size | 4KB (4K x 8) | |
| Program Memory Type | OTP | |
| EEPROM Size | - | |
| RAM Size | 128 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 6 V | |
| Data Converters | A/D 4x8b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 20-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 20-DIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | P87LPC767FN,112 | |
| Related Links | P87LPC7, P87LPC767FN,112 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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