Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PA0230-S | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Circuit Assembly Instr | |
| Standard Package | 1 | |
| Category | Soldering, Desoldering, Rework Products | |
| Family | Solder Stencils, Templates | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PA0230-S | |
| Related Links | PA02, PA0230-S Datasheet, Chip Quik Distributor | |
![]() | RT0402BRD072K2L | RES SMD 2.2K OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | RG3216P-3303-D-T5 | RES SMD 330K OHM 0.5% 1/4W 1206 | datasheet.pdf | |
![]() | MAX13487EESA+T | IC TXRX RS485/RS422 8-SOIC | datasheet.pdf | |
![]() | MAX920EUK+TG071 | IC COMPARATOR BTR SOT23-5 | datasheet.pdf | |
![]() | SP232EEP-L | IC DVR/RCVR RS232 ESD 16DIP | datasheet.pdf | |
![]() | 25A512-I/SN | IC EEPROM 512KBIT 10MHZ 8SOIC | datasheet.pdf | |
![]() | CMF555M0500BHEK | RES 5.05M OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | 5SGXEA4H3F35C4N | IC FPGA 552 I/O 1152FBGA | datasheet.pdf | |
![]() | 10114508-Q0J-30DLF | XCEDE RIGHT 6PVH 4COL WK | datasheet.pdf | |
![]() | 8N4SV75BC-0174CDI | IC OSC VCXO 136MHZ 6CLCC | datasheet.pdf | |
![]() | CD30FD752GO3 | CAP MICA 7500PF 2% 500V RADIAL | datasheet.pdf | |
![]() | ATS-21F-126-C2-R0 | HEATSINK 54X54X15MM XCUT T766 | datasheet.pdf |