Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC12F635-E/SN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Asynchronous Stimulus | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 Multiple Devices Datasheet Update 18/Aug/2014 | |
PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Standard Package | 100 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® 12F | |
Packaging | Tube | |
Core Processor | PIC | |
Core Size | 8-Bit | |
Speed | 20MHz | |
Connectivity | - | |
Peripherals | Brown-out Detect/Reset, POR, WDT | |
Number of I/O | 5 | |
Program Memory Size | 1.75KB (1K x 14) | |
Program Memory Type | FLASH | |
EEPROM Size | 128 x 8 | |
RAM Size | 64 x 8 | |
Voltage - Supply (Vcc/Vdd) | 2 V ~ 5.5 V | |
Data Converters | - | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 125°C | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-SOIC N | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC12F635-E/SN | |
Related Links | PIC12F6, PIC12F635-E/SN Datasheet, Microchip Technology Distributor |
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