Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC16LC558-04/P | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Asynchronous Stimulus | |
| Design Resources | Development Tool Selector | |
| PCN Assembly/Origin | Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Qualification Revision 18/Dec/2013 Qualification Revision 06/Feb/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 25 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® 16C | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 8-Bit | |
| Speed | 4MHz | |
| Connectivity | - | |
| Peripherals | POR, WDT | |
| Number of I/O | 13 | |
| Program Memory Size | 3.5KB (2K x 14) | |
| Program Memory Type | OTP | |
| EEPROM Size | - | |
| RAM Size | 128 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.5 V ~ 5.5 V | |
| Data Converters | - | |
| Oscillator Type | External | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 18-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 18-PDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC16LC558-04/P | |
| Related Links | PIC16LC, PIC16LC558-04/P Datasheet, Microchip Technology Distributor | |
![]() | SMB1Y-H | WIRE MARKER B/Y .10-.20"1000PC | datasheet.pdf | |
![]() | UP5S-150-R | FIXED IND 15UH 3.6A 35 MOHM SMD | datasheet.pdf | |
![]() | GCC44DRTH-S734 | CONN EDGECARD 88POS DIP .100 SLD | datasheet.pdf | |
![]() | CS496112-CQZR | IC DSP 32BIT 8CH SER I/O 144LQFP | datasheet.pdf | |
![]() | ES3F-E3/9AT | DIODE GEN PURP 300V 3A DO214AB | datasheet.pdf | |
![]() | RLR07C4752FPBSL | RES 47.5K OHM 1% 1/4W AXIAL | datasheet.pdf | |
![]() | FSR-2 | FOOT CYLINDRICAL 0.394" DIA BLK | datasheet.pdf | |
![]() | ELXG350VSN332MP30S | CAP ALUM 3300UF 20% 35V SNAP | datasheet.pdf | |
![]() | EMI1812R-125 | EMI CHIP BEAD UH SMD | datasheet.pdf | |
![]() | PHP00805H2840BST1 | RES SMD 284 OHM 0.1% 5/8W 0805 | datasheet.pdf | |
![]() | EBSGJNZWY | EYSFCNZZX, EYSGJNZWY EVALUATION | datasheet.pdf | |
![]() | BFC236657332 | CAP FILM 3.3NF 5% 400VDC RAD | datasheet.pdf |