Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC18F67J10 DEVELOPMENT BOARD KIT | |
Lead Free Status / RoHS Status | Not applicable / Not applicable | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Standard Package | 1 | |
Category | Programmers, Development Systems | |
Family | Evaluation Boards - Embedded - MCU, DSP | |
Series | PIC® | |
Board Type | Evaluation Platform | |
Type | MCU 8-Bit | |
Core Processor | PIC | |
Operating System | - | |
Platform | - | |
For Use With/Related Products | PIC18F67J10 | |
Mounting Type | Fixed | |
Contents | Board(s) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC18F67J10 DEVELOPMENT BOARD KIT | |
Related Links | PIC18F67J10 DEVE, PIC18F67J10 DEVELOPMENT BOARD KIT Datasheet, Custom Computer Services Distributor |
![]() | BN104G0154K-- | CAP FILM 0.15UF 10% 250VDC RAD | datasheet.pdf | |
![]() | UKT1E330MDD | CAP ALUM 33UF 20% 25V RADIAL | datasheet.pdf | |
![]() | LTC2635CUD-HZ12#TRPBF | IC DAC 12BIT I2C QUAD 16-QFN | datasheet.pdf | |
![]() | D38999/20FC8PNL | CONN HSG RCPT 8POS WALL MNT PINS | datasheet.pdf | |
![]() | 222D253-3/86-0 | BOOT MOLDED | datasheet.pdf | |
![]() | VE-2NF-CX-F4 | CONVERTER MOD DC/DC 72V 75W | datasheet.pdf | |
![]() | RNC55H4301FSB14 | RES 4.3K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | B43252A4337M | CAP ALUM 330UF 20% 350V SNAP | datasheet.pdf | |
![]() | B43511A5108M | CAP ALUM 1000UF 20% 450V SNAP | datasheet.pdf | |
![]() | CMF5018K700FKEB | RES 18.7K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | 5KP160CE3/TR13 | TVS DIODE 160VWM 287VC P600 | datasheet.pdf | |
![]() | 09652217701 | D-Sub Connector Plug, Male Pins 15 Position Through Hole Solder | datasheet.pdf |