Microchip Technology PIC24F08KA102-E/ML
- Mfg. Part Number
- PIC24F08KA102-E/ML
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 8KB FLASH 28QFN
- Datasheet Download
- PIC24F08KA102-E/ML.pdf
Availability of PIC24F08KA102-E/ML
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.15000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24F08KA102-E/ML, we specialize in Microchip Technology all series electronic components. PIC24F08KA102-E/ML can be shipped within 24 hours after order. If you have any demands for PIC24F08KA102-E/ML, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24F08KA102-E/ML Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24F08KA102-E/ML
| Internal Part Number | EIS-PIC24F08KA102-E/ML | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24F16KA102 Datasheet/Errata Update 30/Jan/2014 PIC24F16KA102 Errata/Datasheet Update 15/Apr/2014 Dataheet/Errata Update 10/Jul/2014 Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 Errata/Datasheet Update 13/Jul/2015 | |
| PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 61 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 8KB (2.75K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 1.5K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F08KA102-E/ML | |
| Related Links | PIC24F08K, PIC24F08KA102-E/ML Datasheet, Microchip Technology Distributor | |
PIC24F08KA102-E/ML Details Description
Related parts for PIC24F08KA102-E/ML
 | AH72535559-A | SWITCH MINI SPST HINGE LVR.187QC | datasheet.pdf | |
| EEM10DSXS | CONN EDGECARD 20POS DIP .156 SLD | datasheet.pdf | |
| RGM08DRMN-S273 | CONN EDGECARD 16POS .156 SQ WW | datasheet.pdf | |
 | MIC37139-1.8YS | IC REG LDO 1.8V 1.5A SOT223 | datasheet.pdf | |
 | 380LQ821M250J042 | CAP ALUM 820UF 20% 250V SNAP | datasheet.pdf | |
| FLUKE-88-5/A KIT | KIT COMBO AUTOMOTIVE METER | datasheet.pdf | |
 | MCR10EZHFLR300 | RES SMD 0.3 OHM 1% 1/4W 0805 | datasheet.pdf | |
| ADPFF3J04AC | SWITCH SNAP ACTING | datasheet.pdf | |
| 5444479 | TERM BLOCK HEADER | datasheet.pdf | |
 | GRM1885C1H6R2CA01D | CAP CER 6.2PF 50V NP0 0603 | datasheet.pdf | |
| ATS-10B-191-C1-R0 | HEATSINK 45X45X30MM R-TAB | datasheet.pdf | |
 | WR44-U900-NE1-RF | CELLULAR ROUTER GLOBAL WR44 | datasheet.pdf |