Microchip Technology PIC24F08KA102-I/SS
- Mfg. Part Number
- PIC24F08KA102-I/SS
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 8KB FLASH 28SSOP
- Datasheet Download
- PIC24F08KA102-I/SS.pdf
Availability of PIC24F08KA102-I/SS
Available Quantity
5372 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 1.73000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24F08KA102-I/SS, we specialize in Microchip Technology all series electronic components. PIC24F08KA102-I/SS can be shipped within 24 hours after order. If you have any demands for PIC24F08KA102-I/SS, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24F08KA102-I/SS Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24F08KA102-I/SS
| Internal Part Number | EIS-PIC24F08KA102-I/SS | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24F16KA102 Datasheet/Errata Update 30/Jan/2014 PIC24F16KA102 Errata/Datasheet Update 15/Apr/2014 Dataheet/Errata Update 10/Jul/2014 Copper Bond Wire 17/Dec/2014 Errata/Datasheet Update 13/Jul/2015 | |
| PCN Assembly/Origin | Mold Compound Update 30/Jul/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 47 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 8KB (2.75K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 1.5K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-SSOP (0.209", 5.30mm Width) | |
| Supplier Device Package | 28-SSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F08KA102-I/SS | |
| Related Links | PIC24F08K, PIC24F08KA102-I/SS Datasheet, Microchip Technology Distributor | |
PIC24F08KA102-I/SS Details Description
Related parts for PIC24F08KA102-I/SS
 | 1N4747A,113 | DIODE ZENER 20V 1W DO41 | datasheet.pdf | |
 | GBB20DHAR | CONN EDGECARD 40POS R/A .050 SLD | datasheet.pdf | |
| 5532222803F | LED CBI 3MM BI-LVL GRN/GRN TINT | datasheet.pdf | |
| 5680100022F | LED CBI 3MM 4X1 X,X,GRN,GRN | datasheet.pdf | |
| VE-J3N-EY-F1 | CONVERTER MOD DC/DC 18.5V 50W | datasheet.pdf | |
 | RNC55J9761FSBSL | RES 9.76K OHM 1/8W 1% AXIAL | datasheet.pdf | |
 | RN60C1102DRSL | RES 11K OHM 1/4W .5% AXIAL | datasheet.pdf | |
| MS27468T11B98JB-LC | CONN HSG RCPT JAM NUT 6POS SKT | datasheet.pdf | |
| 09170149622 | SEK 17-14(2)M-S32-AU KONTAKT 1 | datasheet.pdf | |
| 4MA074250Z4AACTGI | OSC MEMS 74.25MHZ LVDS SMD | datasheet.pdf | |
| M2B15BA5G03-CG | SWITCH PUSHBUTTON SPDT 0.4VA 28V | datasheet.pdf | |
 | XC95108F-20PQG160I | Flash PLD, 20ns, CMOS, PQFP160 IC | datasheet.pdf |