Microchip Technology PIC24F16KA102-E/SP
- Mfg. Part Number
- PIC24F16KA102-E/SP
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 16KB FLASH 28SDIP
- Datasheet Download
- PIC24F16KA102-E/SP.pdf
Availability of PIC24F16KA102-E/SP
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.33000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24F16KA102-E/SP, we specialize in Microchip Technology all series electronic components. PIC24F16KA102-E/SP can be shipped within 24 hours after order. If you have any demands for PIC24F16KA102-E/SP, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24F16KA102-E/SP Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24F16KA102-E/SP
| Internal Part Number | EIS-PIC24F16KA102-E/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Video File | World's Lowest Power in Sleep MCU: nanoWatt XLP | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24F16KA102 Datasheet/Errata Update 30/Jan/2014 PIC24F16KA102 Errata/Datasheet Update 15/Apr/2014 Dataheet/Errata Update 10/Jul/2014 Copper Bond Wire 07/Apr/2015 Errata/Datasheet Update 13/Jul/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 22/Apr/2014 Qualification Revision 23/Jun/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 16KB (5.5K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 1.5K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F16KA102-E/SP | |
| Related Links | PIC24F16K, PIC24F16KA102-E/SP Datasheet, Microchip Technology Distributor | |
PIC24F16KA102-E/SP Details Description
Related parts for PIC24F16KA102-E/SP
 | 814-22-026-30-002101 | CONN SPRING 26POS DUAL .295 SMD | datasheet.pdf | |
 | RG3216P-2672-B-T5 | RES SMD 26.7K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
 | MPDRX312S | CONV DC/DC 16A 3-5.5VIN HI-SPEED | datasheet.pdf | |
 | GRM0336S1E9R2DD01D | CAP CER 9.2PF 25V S2H 0201 | datasheet.pdf | |
 | BSO080P03S H | MOSFET P-CH 30V 12.6A 8DSO | datasheet.pdf | |
 | CDRR157NP-331MC | FIXED IND 330UH 700MA 738 MOHM | datasheet.pdf | |
| 399-83-139-10-003101 | Connector Socket 39 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
| 98414-F10-10ULF | CONN HEADER STRT | datasheet.pdf | |
 | SIT3822AI-2C-25EY | OSC MEMS PROG 5.0X3.2MM 2.5V | datasheet.pdf | |
| 51761-10001602AALF | PWRBLADE R/A LF REC | datasheet.pdf | |
| BFC237535243 | CAP FILM 24NF 3.5% 1600VDC RAD | datasheet.pdf | |
| ACC05A22-2P-003-LC | ER 3C 3#8 PIN PLUG | datasheet.pdf |