Microchip Technology PIC24FJ32GB002-I/SP
- Mfg. Part Number
- PIC24FJ32GB002-I/SP
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 28SDIP
- Datasheet Download
- PIC24FJ32GB002-I/SP.pdf
Availability of PIC24FJ32GB002-I/SP
Available Quantity
5276 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.70000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24FJ32GB002-I/SP, we specialize in Microchip Technology all series electronic components. PIC24FJ32GB002-I/SP can be shipped within 24 hours after order. If you have any demands for PIC24FJ32GB002-I/SP, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24FJ32GB002-I/SP Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24FJ32GB002-I/SP
| Internal Part Number | EIS-PIC24FJ32GB002-I/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Assembly/Origin | Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Additional Fabrication Site 11/Oct/2013 Qualification Revision 18/Dec/2013 Qualification SPDIP-28 Package 26/Dec/2013 Qualification Revision 06/Feb/2014 Qualification Copper Wire 26/Mar/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 19 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24FJ32GB002-I/SP | |
| Related Links | PIC24FJ32, PIC24FJ32GB002-I/SP Datasheet, Microchip Technology Distributor | |
PIC24FJ32GB002-I/SP Details Description
Related parts for PIC24FJ32GB002-I/SP
 | HFB143064-300 | FERRITE BEAD CORE EMI H/F 6.35MM | datasheet.pdf | |
 | M16-JY-5 | PILOT LIGHT 5V INCAND RECT YEL | datasheet.pdf | |
 | CRCW0805576KFKTA | RES SMD 576K OHM 1% 1/8W 0805 | datasheet.pdf | |
| A3PA-5121 | WHITE SCREEN | datasheet.pdf | |
-28.jpg) | C3225X7R1E685M250AB | CAP CER 6.8UF 25V X7R 1210 | datasheet.pdf | |
| VI-B3B-IX-F1 | CONVERTER MOD DC/DC 95V 75W | datasheet.pdf | |
 | CBR06C608A5GAC | CAP CER 0.60PF 50V NP0 0603 | datasheet.pdf | |
| ATS-02C-173-C2-R0 | HEATSINK 30X30X30MM R-TAB T766 | datasheet.pdf | |
| EW02615100J0G | 1016 TB SOC RA PCB/DOWN | datasheet.pdf | |
| LQW15CA59NJ00D | FIXED IND 59NH 1A 95 MOHM SMD | datasheet.pdf | |
| ACA3106E20-14PBF80F42 | ACB 5C 2#8 3#12 PIN PLUG | datasheet.pdf | |
 | AD5339ARM-REEL7 | 2.5 V to 5.5 V, 250 UA, 2-Wire Interface Dual-Voltage Output, 8-/10-/12-Bit DACs IC | datasheet.pdf |