Microchip Technology PIC24FJ32GB002-I/SP
- Mfg. Part Number
- PIC24FJ32GB002-I/SP
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 28SDIP
- Datasheet Download
- PIC24FJ32GB002-I/SP.pdf
Availability of PIC24FJ32GB002-I/SP
Available Quantity
5276 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.70000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24FJ32GB002-I/SP, we specialize in Microchip Technology all series electronic components. PIC24FJ32GB002-I/SP can be shipped within 24 hours after order. If you have any demands for PIC24FJ32GB002-I/SP, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24FJ32GB002-I/SP Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24FJ32GB002-I/SP
| Internal Part Number | EIS-PIC24FJ32GB002-I/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Assembly/Origin | Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Additional Fabrication Site 11/Oct/2013 Qualification Revision 18/Dec/2013 Qualification SPDIP-28 Package 26/Dec/2013 Qualification Revision 06/Feb/2014 Qualification Copper Wire 26/Mar/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 19 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24FJ32GB002-I/SP | |
| Related Links | PIC24FJ32, PIC24FJ32GB002-I/SP Datasheet, Microchip Technology Distributor | |
PIC24FJ32GB002-I/SP Details Description
Related parts for PIC24FJ32GB002-I/SP
 | B32529C5155J | CAP FILM 1.5UF 5% 50VDC RADIAL | datasheet.pdf | |
 | 2200HT-331-V | FIXED IND 330UH 3.1A 180 MOHM TH | datasheet.pdf | |
 | XC6VSX315T-3FFG1759C | IC FPGA 720 I/O 1759FCBGA | datasheet.pdf | |
| TXR40AB00-1804AI | CONN BACKSHELL ADPT SZ 19F OLIVE | datasheet.pdf | |
 | 3386X-1-201T | TRIMMER 200 OHM 0.5W PC PIN | datasheet.pdf | |
 | MCS04020D1601BE100 | RES SMD 1.6K OHM 0.1% 1/16W 0402 | datasheet.pdf | |
| VE-23W-CW-F1 | CONVERTER MOD DC/DC 5.5V 100W | datasheet.pdf | |
| VE-B6R-EW-S | CONVERTER MOD DC/DC 7.5V 100W | datasheet.pdf | |
| 62F22-02-020S-L | OPTICAL ENCODER | datasheet.pdf | |
| ATS-12A-85-C3-R0 | HEATSINK 35X35X10MM R-TAB T412 | datasheet.pdf | |
| 1-849099-9 | LEAD, SGL END ASSY, LGH | datasheet.pdf | |
| D38999/26JG16SA | CONN PLUG 16POS STRGHT W/SKT | datasheet.pdf |