Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC24FV32KA302-I/SP | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Copper Bond Wire 07/Apr/2015 | |
PCN Assembly/Origin | Qualification Copper Wire 22/Apr/2014 Qualification Revision 23/Jun/2014 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Standard Package | 15 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® XLP™ 24F | |
Packaging | Tube | |
Core Processor | PIC | |
Core Size | 16-Bit | |
Speed | 32MHz | |
Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
Number of I/O | 23 | |
Program Memory Size | 32KB (11K x 24) | |
Program Memory Type | FLASH | |
EEPROM Size | 512 x 8 | |
RAM Size | 2K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2 V ~ 5.5 V | |
Data Converters | A/D 13x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 28-DIP (0.300", 7.62mm) | |
Supplier Device Package | 28-SPDIP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC24FV32KA302-I/SP | |
Related Links | PIC24FV32, PIC24FV32KA302-I/SP Datasheet, Microchip Technology Distributor |
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