Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PUMD16,115 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Bond Wire 26/Nov/2014 Copper Bond Wire Revision 26/Jan/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 1 | |
Category | Discrete Semiconductor Products | |
Family | Transistors (BJT) - Arrays, Pre-Biased | |
Series | - | |
Packaging | Cut Tape (CT) | |
Transistor Type | 1 NPN, 1 PNP - Pre-Biased (Dual) | |
Current - Collector (Ic) (Max) | 100mA | |
Voltage - Collector Emitter Breakdown (Max) | 50V | |
Resistor - Base (R1) (Ohms) | 22k | |
Resistor - Emitter Base (R2) (Ohms) | 47k | |
DC Current Gain (hFE) (Min) @ Ic, Vce | 80 @ 5mA, 5V | |
Vce Saturation (Max) @ Ib, Ic | 150mV @ 500µA, 10mA | |
Current - Collector Cutoff (Max) | 1µA | |
Frequency - Transition | - | |
Power - Max | 300mW | |
Mounting Type | Surface Mount | |
Package / Case | 6-TSSOP, SC-88, SOT-363 | |
Supplier Device Package | 6-TSSOP | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PUMD16,115 | |
Related Links | PUMD1, PUMD16,115 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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