Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PUMD2,115 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | NXP - I²C Interface | |
| PCN Design/Specification | Resin Hardener 02/Jul/2013 Copper Bond Wire 26/Nov/2014 Copper Bond Wire Revision 26/Jan/2015 | |
| PCN Packaging | Lighter Reels 02/Jan/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 3,000 | |
| Category | Discrete Semiconductor Products | |
| Family | Transistors (BJT) - Arrays, Pre-Biased | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Transistor Type | 1 NPN, 1 PNP - Pre-Biased (Dual) | |
| Current - Collector (Ic) (Max) | 100mA | |
| Voltage - Collector Emitter Breakdown (Max) | 50V | |
| Resistor - Base (R1) (Ohms) | 22k | |
| Resistor - Emitter Base (R2) (Ohms) | 22k | |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 60 @ 5mA, 5V | |
| Vce Saturation (Max) @ Ib, Ic | 150mV @ 500µA, 10mA | |
| Current - Collector Cutoff (Max) | 1µA | |
| Frequency - Transition | - | |
| Power - Max | 300mW | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-TSSOP, SC-88, SOT-363 | |
| Supplier Device Package | 6-TSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PUMD2,115 | |
| Related Links | PUMD, PUMD2,115 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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