Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-Q3-0.005-00-30 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| MSDS Material Safety Datasheet | Q-Pad 3 MSDS | |
| RoHS Information | Q-PAd 3 Material Report | |
| Standard Package | 100 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Q-Pad® 3 | |
| Usage | TO-3, TO-66 | |
| Shape | Rhombus | |
| Outline | 31.75mm x 17.78mm | |
| Thickness | 0.0050" (0.127mm) | |
| Material | Elastomer | |
| Adhesive | - | |
| Backing, Carrier | Fiberglass | |
| Color | Black | |
| Thermal Resistivity | 0.35°C/W | |
| Thermal Conductivity | 2.0 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | Q3-0.005-00-30 | |
| Related Links | Q3-0.00, Q3-0.005-00-30 Datasheet, Bergquist Distributor | |
![]() | XC4005XL-3TQ144C | IC FPGA 112 I/O 144TQFP | datasheet.pdf | |
![]() | 12101K5R6CBTTR | CAP THIN FILM 5.6PF 100V 1210 | datasheet.pdf | |
![]() | TLE2037AMD | IC OPAMP GP 50MHZ 8SOIC | datasheet.pdf | |
![]() | MS27497T24B29PA | CONN RCPT 29POS WALL MNT W/PINS | datasheet.pdf | |
![]() | PTN1206E8061BST1 | RES SMD 8.06K OHM 0.1% 0.4W 1206 | datasheet.pdf | |
![]() | SOMOMAP3530-21-1780AGIR | SYSTEM ON MODULE LV OMAP3530 | datasheet.pdf | |
![]() | CMF5511K400BEEB | RES 11.4K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | 1883310000 | SLDV-THR 5.00/40/180FLF 3.2BK | datasheet.pdf | |
![]() | 15-012-171 | CABLE 15POS .100 JUMPER 12 INCH | datasheet.pdf | |
![]() | 0380090011 | STRIP MARKER 3 SPCL | datasheet.pdf | |
![]() | 1993514 | CONN TERM BLOCK | datasheet.pdf | |
![]() | TX-98-0501 | Capacitors Inductors Filters... | datasheet.pdf |