Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-RN55E3570FRSL | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 100 | |
| Category | Resistors | |
| Family | Through Hole Resistors | |
| Series | Military, MIL-R-10509/7, RN55 | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 357 | |
| Tolerance | ±1% | |
| Power (Watts) | 0.125W, 1/8W | |
| Composition | Metal Film | |
| Features | Flame Retardant Coating, Military, Moisture Resistant, Safety | |
| Temperature Coefficient | ±25ppm/°C | |
| Package / Case | Axial | |
| Supplier Device Package | Axial | |
| Size / Dimension | 0.090" Dia x 0.240" L (2.29mm x 6.10mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Failure Rate | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | RN55E3570FRSL | |
| Related Links | RN55E3, RN55E3570FRSL Datasheet, Vishay/Dale Distributor | |
![]() | XCV200-4BG352I | IC FPGA 260 I/O 352MBGA | datasheet.pdf | |
![]() | LTC1174CN8-5 | IC REG BUCK BOOST INV 5V 8DIP | datasheet.pdf | |
![]() | MAX4193EPA+ | IC REG BOOST ADJ 525MA 8DIP | datasheet.pdf | |
| 0034.7108 | FUSE BOARD MNT 200MA 250VAC RAD | datasheet.pdf | ||
![]() | TS-MAC-E3-UT4 | SITE LICENSE ETH MAC TRI ECP3 | datasheet.pdf | |
![]() | 5024262430 | CONN 0.4MM RCPT 24CKT SMD | datasheet.pdf | |
![]() | 0800351 | SAFETY LABEL W/SPECIAL ADHESIVE | datasheet.pdf | |
![]() | Y6078145K000V0L | RES 145K OHM .3W .005% RADIAL | datasheet.pdf | |
![]() | SC16M11D70REV | STRIP HYFEN SOCKET | datasheet.pdf | |
![]() | ADA4177-4ARUZ | IC OPAMP 30V PREC OVP EMI | datasheet.pdf | |
![]() | GL19BF33IET | CRYSTAL 19.660800 MHZ SMD | datasheet.pdf | |
![]() | BK/CB185-150 | CIRCUIT BREAKE | datasheet.pdf |