Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S25FL256SAGBHI210 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | MX25L25635F Migrating from S25FL256S | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 338 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | FL-S | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 256M (32M x 8) | |
| Speed | 133MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 24-TBGA | |
| Supplier Device Package | 24-BGA (6x8) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S25FL256SAGBHI210 | |
| Related Links | S25FL256, S25FL256SAGBHI210 Datasheet, Spansion Distributor | |
![]() | SG-531P 6.0000MC | OSC XO 6.000MHZ CMOS TTL PC PIN | datasheet.pdf | |
![]() | CPU 1.375X1.375 | THERM PAD CPU 1.375" X 1.375" | datasheet.pdf | |
![]() | CTX50-2-52-R | FIXED IND 50UH 4.9A 32.6 MOHM TH | datasheet.pdf | |
![]() | HMM11DRUH | CONN EDGECARD 22POS .156 DIP SLD | datasheet.pdf | |
![]() | MCP1824T-3302E/OT | IC REG LDO 3.3V 0.3A SOT23-5 | datasheet.pdf | |
![]() | IRFU214BTU_FP001 | MOSFET N-CH 250V 2.2A IPAK | datasheet.pdf | |
![]() | 5511809F | LED CBI 3MM RED DIFFUSED RA | datasheet.pdf | |
![]() | ASEMPC-100.000MHZ-LR-T | OSC MEMS 100.000MHZ CMOS SMD | datasheet.pdf | |
![]() | VE-J1F-IZ-F3 | CONVERTER MOD DC/DC 72V 25W | datasheet.pdf | |
![]() | UFS370GE3/TR13 | DIODE GEN PURP 700V 3A DO215AB | datasheet.pdf | |
![]() | 317-83-106-41-026101 | Connector Socket 6 Position 0.070" (1.78mm) Gold Through Hole | datasheet.pdf | |
![]() | 42-10023 | CONN M8 FML 3POS | datasheet.pdf |