Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S25FL256SAGMFI003 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | MX25L25635F Migrating from S25FL256S | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1,450 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | FL-S | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 256M (32M x 8) | |
| Speed | 133MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 16-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S25FL256SAGMFI003 | |
| Related Links | S25FL256, S25FL256SAGMFI003 Datasheet, Spansion Distributor | |
![]() | A2MXT-6018M | ADM60T/AE60M/X | datasheet.pdf | |
![]() | HBC18DRYI-S13 | CONN EDGECARD 36POS .100 EXTEND | datasheet.pdf | |
| RSMF12JT39K0 | RES MO 1/2W 39KOHM 5% AXL | datasheet.pdf | ||
![]() | 1-1776260-1 | TERM BLOCK RCPT 11PS VERT 5.08MM | datasheet.pdf | |
![]() | MDA-V-2-1/2-R | FUSE CERAMIC 2.5A 250VAC 3AB 3AG | datasheet.pdf | |
![]() | RWR80S1470FSS73 | RES 147 OHM 2W 1% WW AXIAL | datasheet.pdf | |
![]() | CAT16-1002F8LF | RES ARRAY 8 RES 10K OHM 2506 | datasheet.pdf | |
![]() | 1212583 | BIT PHILLIPS SZ2 2.76" | datasheet.pdf | |
![]() | TI14215000J0G | 750 TB RIS CLA STACK | datasheet.pdf | |
![]() | TV06DZ-13-98JD | TV 10C 10#20 SKT PLUG | datasheet.pdf | |
![]() | 97-3108A20-15SW-417-940 | AB 7C 7#12 SKT PLUG | datasheet.pdf | |
![]() | XC2V200-5BG352C | XILINX IC XC2V200-5BG352C Available | datasheet.pdf |