Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-SDK-AC4790-200M | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 2 (1 Year) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Other Related Documents | Selection Guide | |
Design Resources | Development Tool Selector | |
PCN Obsolescence/ EOL | RAMP 900MHz 2.4GHz EOL 12/Nov/2015 | |
Standard Package | 3 | |
Category | RF/IF and RFID | |
Family | RF Evaluation and Development Kits, Boards | |
Series | - | |
Type | Transceiver | |
Frequency | 900MHz | |
For Use With/Related Products | AC4790-200M | |
Supplied Contents | 2 Boards, 2 Transceivers, 2 Adapters, 2 Antennas, Cables, CD | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | SDK-AC4790-200M | |
Related Links | SDK-AC4, SDK-AC4790-200M Datasheet, Laird - Embedded Wireless Solutions Distributor |
![]() | 2348-1-00-50-00-00-07-0 | TERM SOLDER TURRET .064".053"L | datasheet.pdf | |
![]() | HBC36DRTH-S93 | CONN EDGECARD 72POS DIP .100 SLD | datasheet.pdf | |
![]() | HMM06DREF | CONN EDGECARD 12POS .156 EYELET | datasheet.pdf | |
![]() | M25P16-VMP6G | IC FLASH 16MBIT 75MHZ 8VFQFPN | datasheet.pdf | |
![]() | RNC55H1374BSBSL | RES 1.37M OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | CMF5510M000JKEB | RES 10M OHM 1/2W 5% AXIAL | datasheet.pdf | |
![]() | ATS-05F-142-C3-R0 | HEATSINK 30X30X15MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-07D-139-C3-R0 | HEATSINK 25X25X20MM L-TAB T412 | datasheet.pdf | |
![]() | EA W162B-BNLW | LCD MOD CHAR 2X16 BLUE-WHITE | datasheet.pdf | |
![]() | UHE2A6R8MDD1TA | CAP ALUM 6.8UF 20% 100V RADIAL | datasheet.pdf | |
![]() | 2-1633124-3 | PLATE REAR SHEAR | datasheet.pdf | |
![]() | LJTPQ00RE-15-4P-014 | LJT 4C 4#12 PIN RECP | datasheet.pdf |