FFF SIP050-1X09-157BLF
- Mfg. Part Number
- SIP050-1X09-157BLF
- Manufacturer
- FFF
- Product Category
- Sockets for ICs, Transistors
- Brief Description
- CONN SOCKET SIP 9POS TIN
- Datasheet Download
- SIP050-1X09-157BLF.pdf
Availability of SIP050-1X09-157BLF
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of SIP050-1X09-157BLF, we specialize in FFF all series electronic components. SIP050-1X09-157BLF can be shipped within 24 hours after order. If you have any demands for SIP050-1X09-157BLF, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- SIP050-1X09-157BLF Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
SIP050-1X09-157BLF
| Internal Part Number | EIS-SIP050-1X09-157BLF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices/Sockets 04/Dec/2008 | |
| Standard Package | 1,000 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | SIP050-1x | |
| Packaging | Bulk | |
| Type | SIP | |
| Number of Positions or Pins (Grid) | 9 (1 x 9) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Tin | |
| Contact Finish Thickness - Mating | 200µin (5.08µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Finish Thickness - Post | 200µin (5.08µm) | |
| Contact Material - Post | Brass | |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
| Operating Temperature | - | |
| Termination Post Length | 0.095" (2.41mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | - | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SIP050-1X09-157BLF | |
| Related Links | SIP050-1X, SIP050-1X09-157BLF Datasheet, FFF Distributor | |
SIP050-1X09-157BLF Details Description
Related parts for SIP050-1X09-157BLF
| 3057Y-1-201 | TRIMMER 200 OHM 1W PC PIN | datasheet.pdf | |
,-SC-63.jpg) | 6CWQ03FN | DIODE ARRAY SCHOTTKY 30V DPAK | datasheet.pdf | |
| FCA1206C154M | CAP FILM 0.15UF 20% 16VDC 1206 | datasheet.pdf | |
| UVP2A2R2MED | CAP ALUM 2.2UF 20% 100V RADIAL | datasheet.pdf | |
| 0752354249 | CONN HEADER BACKPLAN 200POS GOLD | datasheet.pdf | |
| DTS24W19-11AA | CONN HSG RCPT JAM NUT 11POS PIN | datasheet.pdf | |
 | MDMK2020T2R2MM | FIXED IND 2.2UH 1.45A 109 MOHM | datasheet.pdf | |
 | 8SLVP1204ANLGI/W | IC CLK BUFFER 2:4 2GHZ 16VFQFPN | datasheet.pdf | |
 | RDED72W105MUE1C13A | CAP CER 1UF 450V X7T RADIAL | datasheet.pdf | |
| L177DFB25SV | D-Sub Connector Receptacle, Female Sockets 25 Position Through Hole Solder | datasheet.pdf | |
-2.50-mm-x-2.00-mm.jpg) | DSC1101DM2-008.0000T | OSC MEMS 8.000MHZ CMOS SMD | datasheet.pdf | |
| NX-SPT-68(61) | TOOL ACCY | datasheet.pdf |