Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-SIP1X27-001BLF | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Multiple Devices/Sockets 04/Dec/2008 | |
Standard Package | 300 | |
Category | Connectors, Interconnects | |
Family | Sockets for ICs, Transistors | |
Series | SIP1x | |
Packaging | Bulk | |
Type | SIP | |
Number of Positions or Pins (Grid) | 27 (1 x 27) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Tin | |
Contact Finish Thickness - Post | 200µin (5.08µm) | |
Contact Material - Post | Brass | |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
Operating Temperature | - | |
Termination Post Length | 0.125" (3.18mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | - | |
Contact Resistance | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | SIP1X27-001BLF | |
Related Links | SIP1X27, SIP1X27-001BLF Datasheet, FFF Distributor |
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