Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SLE 4418 M2.2 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Specialized ICs | |
| Series | - | |
| Packaging | Bulk | |
| Type | Memory | |
| Applications | Security | |
| Mounting Type | - | |
| Package / Case | M2.2 Chip Card Module | |
| Supplier Device Package | M2.2 Chip Card Module | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SLE 4418 M2.2 | |
| Related Links | SLE 44, SLE 4418 M2.2 Datasheet, Infineon Technologies Distributor | |
![]() | SMBJ75CA-TP | TVS DIODE 75VWM 121VC SMB | datasheet.pdf | |
![]() | ACB70DHFD | CONN EDGECARD 140POS .050 SMD | datasheet.pdf | |
![]() | ABC15DREN-S734 | CONN EDGECARD 30POS .100 EYELET | datasheet.pdf | |
![]() | RMCF1206FT9K76 | RES SMD 9.76K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | STFI13N95K3 | MOSFET N CH 950V 10A I2PAKFP | datasheet.pdf | |
![]() | WHS3-3R3JA1 | RES 3.3 OHM 3W 5% AXIAL | datasheet.pdf | |
![]() | ATS-01G-157-C3-R0 | HEATSINK 40X40X30MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-04E-132-C2-R0 | HEATSINK 60X60X25MM XCUT T766 | datasheet.pdf | |
![]() | MDM-21SH020F | MICRO 21 F 3" YEL FLOAT | datasheet.pdf | |
![]() | 55PC012A-26-9/96CS2666 | 55PC CABLE | datasheet.pdf | |
![]() | MKP385310250JIM2T0 | CAP FILM 0.01UF 5% 2500VDC AXIAL | datasheet.pdf | |
![]() | 3-1906047-1 | FO C/A LC VIO ST 62.5 ORN | datasheet.pdf |