Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SO63-3-00CS2567 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | SolderSleeve Wire Splices | |
| Standard Package | 1,000 | |
| Category | Cables, Wires - Management | |
| Family | Solder Sleeve | |
| Series | SolderSleeve SO63 | |
| Type | Wire to Wire | |
| Diameter | 0.170" (4.3mm), 0.200" (5.1mm) | |
| Length | 0.650" (16.51mm) | |
| Color | Blue, Transparent | |
| Features | Immersion Resistant | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SO63-3-00CS2567 | |
| Related Links | SO63-3-, SO63-3-00CS2567 Datasheet, TE Connectivity Raychem Cable Protection Distributor | |
![]() | PTC13DAEN | CONN HEADER .100 DUAL STR 26POS | datasheet.pdf | |
![]() | T1008-R91G | FIXED IND 910NH 380MA 1.68 OHM | datasheet.pdf | |
![]() | CPPLC7-LZ7PT | OSC 3.3V PROG CMOS TRI ST 50PPM | datasheet.pdf | |
![]() | EEC43DRYS-S93 | CONN EDGECARD 86POS DIP .100 SLD | datasheet.pdf | |
![]() | SY58609UMG | IC MUX 2:1 CML FSI INPUT 16-MLF | datasheet.pdf | |
![]() | MAX14821ETG+T | IC IO-LINK 24-TQFN | datasheet.pdf | |
![]() | RWR81S4530FSRSL | RES 453 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | RN65C4420FRSL | RES 442 OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | 5SGXMB6R2F40I2LN | IC FPGA 432 I/O 1517FBGA | datasheet.pdf | |
![]() | ATS-01H-35-C1-R0 | HEATSINK 36.83X57.6X5.84MM | datasheet.pdf | |
![]() | YD17015000J0G | 500 TB RIS CLA 180D 1ST | datasheet.pdf | |
![]() | RCP1206W100RGS2 | RES SMD 100 OHM 2% 11W 1206 | datasheet.pdf |