Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SP13808 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Featured Product | SESUBPANT2541 Bluetooth Low Energy Module | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | RF/IF and RFID | |
| Family | RF Evaluation and Development Kits, Boards | |
| Series | - | |
| Type | Bluetooth Low Energy (BLE) | |
| Frequency | 2.4GHz | |
| For Use With/Related Products | SESUB-PAN-T2541 | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SP13808 | |
| Related Links | SP1, SP13808 Datasheet, TDK Corporation Distributor | |
![]() | RC0805FR-079M31L | RES SMD 9.31M OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | LM224KN | IC OPAMP GP 1.2MHZ 14DIP | datasheet.pdf | |
![]() | E52-CA2GV 2M | THERMOCOUPLE 0-350C | datasheet.pdf | |
![]() | VE-26Y-EV-F3 | CONVERTER MOD DC/DC 3.3V 99W | datasheet.pdf | |
![]() | ISPLSI 5256VA-100LB208 | IC CPLD 256MC 10NS 208FPBGA | datasheet.pdf | |
![]() | 1604746 | CONN HOOD CPLNG BOTTOM SZB10 M25 | datasheet.pdf | |
![]() | 6445R-012 | XFRMR LAMINATED 10VA THRU HOLE | datasheet.pdf | |
![]() | ATS-10A-20-C3-R0 | HEATSINK 54X54X25MM XCUT T412 | datasheet.pdf | |
![]() | SIT3807AC-D-28NH | OSC MEMS PROG 2.8V SMD | datasheet.pdf | |
![]() | 1619779 | CONN HSG RCPT 17POS JAM NUT PIN | datasheet.pdf | |
![]() | MTAPD-06-014 | PHOTODIODE AVALANCHE IR TO46-2 | datasheet.pdf | |
![]() | CN0967C22A32S7Y040 | 26500 32C 26#20 6#12 S RECP AN | datasheet.pdf |