NXP Semiconductors/Freescale Semiconductor, Inc. SPC5517EAMMG66
- Mfg. Part Number
- SPC5517EAMMG66
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 32BIT 1.5MB FLASH 208BGA
- Datasheet Download
- SPC5517EAMMG66.pdf
Availability of SPC5517EAMMG66
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of SPC5517EAMMG66, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. SPC5517EAMMG66 can be shipped within 24 hours after order. If you have any demands for SPC5517EAMMG66, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- SPC5517EAMMG66 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
SPC5517EAMMG66
| Internal Part Number | EIS-SPC5517EAMMG66 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | MPC55xx Qorivva | |
| Packaging | Tray | |
| Core Processor | e200z0, e200z1 | |
| Core Size | 32-Bit Dual-Core | |
| Speed | 66MHz | |
| Connectivity | CAN, EBI/EMI, I²C, SCI, SPI | |
| Peripherals | DMA, POR, PWM, WDT | |
| Number of I/O | 144 | |
| Program Memory Size | 1.5MB (1.5M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 80K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 4.5 V ~ 5.25 V | |
| Data Converters | A/D 40x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 208-BGA | |
| Supplier Device Package | 208-MAPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SPC5517EAMMG66 | |
| Related Links | SPC5517, SPC5517EAMMG66 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
SPC5517EAMMG66 Details Description
Related parts for SPC5517EAMMG66
 | RG1608P-750-D-T5 | RES SMD 75 OHM 0.5% 1/10W 0603 | datasheet.pdf | |
 | GCB06DHNN | CONN EDGECARD 12POS .050 DIP SLD | datasheet.pdf | |
| 951238-7622-AR | CONN HEADER 38POS 2MM R/A SOLDER | datasheet.pdf | |
 | TC75S51F,LF | IC OPAMP GP 5SSOP | datasheet.pdf | |
 | 1-1879693-0 | RES 133 OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
| VE-24P-CU | CONVERTER MOD DC/DC 13.8V 200W | datasheet.pdf | |
 | RNC55K2152FMBSL | RES 21.5K OHM 1/8W 1% AXIAL | datasheet.pdf | |
| TNM2-6.5-20-3 | ROUND STANDOFF M2 NYLON 20MM | datasheet.pdf | |
 | LDK120C-R | IC REG LDO ADJ 0.2A SOT323-5 | datasheet.pdf | |
 | 5AGXFA5H4F35C4N | IC FPGA 544 I/O 1152FBGA | datasheet.pdf | |
| ATS-04F-207-C1-R0 | HEATSINK 60X60X12MM XCUT | datasheet.pdf | |
 | XC6VHX255T-1FF1155M | Field Programmable Gate Array IC | datasheet.pdf |