Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SST39LF402C-55-4C-B3KE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SST39Vx401C,402C Datasheet Update 17/Apr/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 480 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | SST39 MPF™ | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH | |
| Memory Size | 4M (256K x 16) | |
| Speed | 55ns | |
| Interface | Parallel | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 48-TFBGA | |
| Supplier Device Package | 48-TFBGA (6x8) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SST39LF402C-55-4C-B3KE | |
| Related Links | SST39LF402C, SST39LF402C-55-4C-B3KE Datasheet, Microchip Technology Distributor | |
![]() | PBC33DADN | CONN HEADER .100 DUAL STR 66POS | datasheet.pdf | |
![]() | EGM40DTKT | CONN EDGECARD 80POS DIP .156 SLD | datasheet.pdf | |
![]() | 1N4934G | DIODE GEN PURP 100V 1A DO41 | datasheet.pdf | |
![]() | TNPW20107K15BETF | RES SMD 7.15K OHM 0.1% 0.4W 2010 | datasheet.pdf | |
![]() | 186B12 | XFRMR LAMINATED 6.3VA CHAS MOUNT | datasheet.pdf | |
![]() | RNC60J7870BSR36 | RES 787 OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | UDZVTE-179.1B | DIODE ZENER 9.1V 200MW UMD2 | datasheet.pdf | |
![]() | ATS-11G-06-C3-R0 | HEATSINK 45X45X10MM XCUT T412 | datasheet.pdf | |
![]() | ATS-03H-202-C2-R0 | HEATSINK 54X54X6MM XCUT T766 | datasheet.pdf | |
![]() | MDM-100SH016F | MICRO 100C S 6" RBW FLOAT | datasheet.pdf | |
![]() | OQ07328000J0G | 381 TB SOCKET VERTICAL | datasheet.pdf | |
![]() | 354778-8 | PIN WIRE DISC .2535 MARKED | datasheet.pdf |