Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SUPER BUNDLE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | dsPIC®, PIC® | |
| Board Type | Evaluation Platform | |
| Type | MCU | |
| Core Processor | - | |
| Operating System | - | |
| Platform | - | |
| For Use With/Related Products | Microchip's PIC® MCUs and dsPIC® DSCs | |
| Mounting Type | Socket | |
| Contents | Board(s), Cable(s), LCD, Power Supply, Accessories, U2 Programmer | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SUPER BUNDLE | |
| Related Links | SUPER , SUPER BUNDLE Datasheet, MicroEngineering Labs Inc. Distributor | |
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