MicroEngineering Labs Inc. SUPER BUNDLE

SUPER BUNDLE picture photo
Mfg. Part Number
SUPER BUNDLE
Manufacturer
Product Category
Evaluation Boards - Embedded - MCU, DSP
Brief Description
DEVELOPMENT KIT FOR PIC MCU'S
Datasheet Download
SUPER BUNDLE.pdf
Availability of SUPER BUNDLE

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 616.25000
Our Price
Quote by Email

QUANTITY

 

EIS Components is the stocking Distributor of SUPER BUNDLE, we specialize in MicroEngineering Labs Inc. all series electronic components. SUPER BUNDLE can be shipped within 24 hours after order. If you have any demands for SUPER BUNDLE, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
SUPER BUNDLE Order Process
Add Parts to RFQ form
Submit RFQ
We reply within 24 hours
You confirm order
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Specifications of SUPER BUNDLE
Internal Part NumberEIS-SUPER BUNDLE
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Standard Package1
Category Programmers, Development Systems
FamilyEvaluation Boards - Embedded - MCU, DSP
SeriesdsPIC®, PIC®
Board TypeEvaluation Platform
TypeMCU
Core Processor-
Operating System-
Platform-
For Use With/Related ProductsMicrochip's PIC® MCUs and dsPIC® DSCs
Mounting TypeSocket
ContentsBoard(s), Cable(s), LCD, Power Supply, Accessories, U2 Programmer
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)SUPER BUNDLE
Related LinksSUPER , SUPER BUNDLE Datasheet, MicroEngineering Labs Inc. Distributor
SUPER BUNDLE Details Description
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