Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-T130DMCEI | |
| Lead Free Status / RoHS Status | ||
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cables, Wires - Management | |
| Family | Wire Ducts, Raceways - Accessories | |
| Series | Pan-Way® | |
| Accessory Type | Cover, Duplex, 1 Gang | |
| For Use With/Related Products | Panduit Duct Type T130 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | T130DMCEI | |
| Related Links | T130, T130DMCEI Datasheet, Panduit Distributor | |
![]() | 74HC4538D,653 | IC MULTIVIBRATR DUAL MONO 16SOIC | datasheet.pdf | |
![]() | P6SMB15CA | TVS DIODE 12.8VWM 21.2VC SMD | datasheet.pdf | |
![]() | DF08MA-E3/45 | DIODE GPP 1A 800V 4DIP | datasheet.pdf | |
![]() | 202236-6 | CONN PIN SOLDER CPC TIN | datasheet.pdf | |
![]() | MCW0406MD5239BP100 | RES SMD 52.3 OHM 1/4W 0604 WIDE | datasheet.pdf | |
![]() | 3282-9PG-530 | CONN PLUG 9POS INLINE PIN | datasheet.pdf | |
![]() | ATS-13A-67-C2-R0 | HEATSINK 45X45X10MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-12E-33-C2-R0 | HEATSINK 57.9X36.83X17.78MM T766 | datasheet.pdf | |
![]() | ERA-2APB273X | RES SMD 27K OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | ADSP-BR514BSWZ-3 | PROCESSOR | datasheet.pdf | |
![]() | XC2S300E-1FG456I | IC FPGA 182 I/O 256FTBGA | datasheet.pdf | |
![]() | XC2V2000-5FT896C | IC FPGA 624 I/O 957FCBGA | datasheet.pdf |