Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TC58BVG2S0HTAI0 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 96 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | Benand™ | |
| Packaging | Tray | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM - NAND | |
| Memory Size | 4G (512M x 8) | |
| Speed | 25ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) | |
| Supplier Device Package | 48-TSOP I | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TC58BVG2S0HTAI0 | |
| Related Links | TC58BVG, TC58BVG2S0HTAI0 Datasheet, Toshiba Semiconductor & Storage Distributor | |
![]() | 5513 | FIXED IND 100UH 6.8A 38 MOHM TH | datasheet.pdf | |
![]() | 1-592629-9 | MODULE FEEDBACK 21 SIZE | datasheet.pdf | |
![]() | TNPU06036K04BZEN00 | RES SMD 6.04KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 663S3SS6L | CABLE R/A FEMALE/FEMALE 3POS 6M | datasheet.pdf | |
![]() | TNM12-30-94-3 | ROUND STANDOFF M12 NYLON 94MM | datasheet.pdf | |
![]() | 70098-1430 | EDGE SENSOR | datasheet.pdf | |
![]() | 7500BK | GROUNDED HANDLE 3 WIRE W/BURN RE | datasheet.pdf | |
![]() | ATS-13G-95-C3-R0 | HEATSINK 40X40X30MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-09D-152-C2-R0 | HEATSINK 35X35X35MM L-TAB T766 | datasheet.pdf | |
![]() | POD1PP-T-1 | TOOLING | datasheet.pdf | |
![]() | 1855125-1 | HDM W/FA SMPO067F062F LM (CUTS) | datasheet.pdf | |
![]() | D38999/24ZH35SN-LC | TV 100C 100#22D SKT J/N RECP | datasheet.pdf |