Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TDGL004 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Cerebot 32MX7 Schematics Development Tool Selector | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | PIC® | |
| Board Type | Evaluation Platform | |
| Type | MCU 32-Bit | |
| Core Processor | MIPS32® M4K™ | |
| Operating System | - | |
| Platform | Cerebot MX7 | |
| For Use With/Related Products | PIC32MX795F512L | |
| Mounting Type | Fixed | |
| Contents | Board(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TDGL004 | |
| Related Links | TDG, TDGL004 Datasheet, Microchip Technology Distributor | |
![]() | 1688700000 | TERM BLOCK PLUG 6POS 5.08MM | datasheet.pdf | |
![]() | SP400-0.009-00-58 | THERMAL PAD TO-220 .009" SP400 | datasheet.pdf | |
![]() | 9T04021A2670CBHF3 | RES SMD 267 OHM 0.25% 1/16W 0402 | datasheet.pdf | |
![]() | PA-5R0H474-R | CAP 470MF -20% +80% 5V T/H | datasheet.pdf | |
![]() | CRCW0805102RFKTA | RES SMD 102 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | AMC19DRYS-S93 | CONN EDGECARD 38POS DIP .100 SLD | datasheet.pdf | |
![]() | GRM1885C1H332JA01D | CAP CER 3300PF 50V NP0 0603 | datasheet.pdf | |
![]() | FODM8061R2V | OPTOISO 3.75KV OPEN COLL 5MFP | datasheet.pdf | |
![]() | VE-JV1-MZ-F3 | CONVERTER MOD DC/DC 12V 25W | datasheet.pdf | |
![]() | CRCW120615R0JNTC | RES SMD 15 OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | VJ0805D910MLPAJ | CAP CER 91PF 250V NP0 0805 | datasheet.pdf | |
![]() | EC1647-000 | MARKERS | datasheet.pdf |