Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TDGL008 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | PIC® | |
| Board Type | Evaluation Platform | |
| Type | MCU 32-Bit | |
| Core Processor | MIPS32® M4K™ | |
| Operating System | - | |
| Platform | Cerebot MX3cK | |
| For Use With/Related Products | PIC32MX320F128 | |
| Mounting Type | Fixed | |
| Contents | Board(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TDGL008 | |
| Related Links | TDG, TDGL008 Datasheet, Microchip Technology Distributor | |
![]() | PZC22SAHN | CONN HEADER .100 SINGL STR 22POS | datasheet.pdf | |
![]() | 20ETF02S | DIODE GEN PURP 200V 20A D2PAK | datasheet.pdf | |
![]() | C0603C0G1H620J | CAP CER 62PF 50V C0G 0201 | datasheet.pdf | |
![]() | RNCF0805BKT3K24 | RES SMD 3.24K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | MSP430F2013QRSATEP | IC MCU 16BIT 2KB FLASH 16QFN | datasheet.pdf | |
![]() | RN55D7872FR36 | RES 78.7K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | CMF071K5000JNRE | RES 1.5K OHM 1/2W 5% AXIAL | datasheet.pdf | |
![]() | TPS54340DDAR | IC REG BUCK ADJ 3.5A 8SOPWRPAD | datasheet.pdf | |
![]() | 714-87-104-31-018101 | PCB CONN CARRIER 2.54MM | datasheet.pdf | |
![]() | 0387600117 | Connector Barrier Block Strip 17 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | CSD23203WT | MOSFET P-CH 8V 3A 6DSBGA | datasheet.pdf | |
![]() | MFL22GX010004XX4XX | MULTIMODE COUPLER 1M | datasheet.pdf |