Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TGX-300-300-2.0-0 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Die-Cut Tolerence Guide | |
| MSDS Material Safety Datasheet | TGX MSDS | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | TG-X | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 300.00mm x 300.00mm | |
| Thickness | 0.079" (2.00mm) | |
| Material | Silicone Elastomer | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | - | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 12.0 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TGX-300-300-2.0-0 | |
| Related Links | TGX-300-, TGX-300-300-2.0-0 Datasheet, t-Global Technology Distributor | |
![]() | 929852-01-33-10 | Connector Receptacle 66 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | SY100EL15ZI-TR | IC CLK BUFFER 2:4 16SOIC | datasheet.pdf | |
![]() | TSW-113-08-G-D-RA | CONN HEADER 26POS .100 DL R/A AU | datasheet.pdf | |
![]() | EEC31DRXH | CONN EDGECARD 62POS DIP .100 SLD | datasheet.pdf | |
![]() | ASFLM1-11.0592MHZ-LC-T | OSC MEMS 11.0592MHZ CMOS SMD | datasheet.pdf | |
![]() | MT4HTF12864HZ-667C1 | MODULE DDR2 SDRAM 1GB 240UDIMM | datasheet.pdf | |
![]() | 63RX301500M18X40 | CAP ALUM 1500UF 20% 63V RADIAL | datasheet.pdf | |
![]() | WSN802GDK | KIT DEV WSN802G PRECONFIGURED AP | datasheet.pdf | |
![]() | CMF555K4900BHEB | RES 5.49K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | 10114830-11115LF | WTB 1.25 WAFER 90 SMT | datasheet.pdf | |
![]() | GRM32ER61H106MA12L | CAP CER 10UF 50V X5R 1210 | datasheet.pdf | |
![]() | TVP00RW-25-29BE | TV 29C 29#16 SKT RECP | datasheet.pdf |