Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-THINC23-21.5-11.4-5.8-0.8 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Introduction to the THINC Range of Thermally Conductive Caps | |
| Featured Product | THINC Series | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | THINC | |
| Usage | Sheet | |
| Shape | Rectangle | |
| Outline | 21.50mm x 11.40mm x 5.80mm | |
| Thickness | 0.031" (0.80mm) | |
| Material | Silicone | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 1.9 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | THINC23-21.5-11.4-5.8-0.8 | |
| Related Links | THINC23-21.5, THINC23-21.5-11.4-5.8-0.8 Datasheet, t-Global Technology Distributor | |
![]() | SDR1005-682J | FIXED IND 6.8MH 110MA 30 OHM SMD | datasheet.pdf | |
![]() | 9T12062A2263BAHFT | RES SMD 226K OHM 0.1% 1/8W 1206 | datasheet.pdf | |
![]() | LD1086DT18TR | IC REG LDO 1.8V 1.5A DPAK | datasheet.pdf | |
![]() | 825F25R | RES CHAS MNT 25 OHM 1% 25W | datasheet.pdf | |
![]() | HSC43DRYS-S93 | CONN EDGECARD 86POS DIP .100 SLD | datasheet.pdf | |
![]() | MS27473E24A4P | CONN PLUG 56POS STRAIGHT W/PINS | datasheet.pdf | |
![]() | 1957210000 | BLZP 5.00/10/180LH SN BK BX | datasheet.pdf | |
![]() | 1734298-1 | SHIELD FINGER | datasheet.pdf | |
![]() | AS8C403600-QC150N | IC SRAM 128K X 36 100-TQFP | datasheet.pdf | |
![]() | 1705126 | RS-KDS 2 5-LA | datasheet.pdf | |
![]() | 322A315-3-0 | STD POLY MOLDED PARTS | datasheet.pdf | |
![]() | MS27473T18A35P-UTHST3 | JT 66C 66#22D PIN PLUG | datasheet.pdf |