Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-THS3111IDGN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
| PCN Design/Specification | SOT23, VSSOP Cu Wire 28/Jun/2013 Copper Wire Revision C 24/Sep/2014 | |
| PCN Assembly/Origin | Additional Assembly/Test Site 12/Sep/2013 Assembly/Test Site Revision B 15/Oct/2014 | |
| Standard Package | 80 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tube | |
| Amplifier Type | Current Feedback | |
| Number of Circuits | 1 | |
| Output Type | - | |
| Slew Rate | 1300 V/µs | |
| Gain Bandwidth Product | - | |
| -3db Bandwidth | 100MHz | |
| Current - Input Bias | 1.5µA | |
| Voltage - Input Offset | 3mV | |
| Current - Supply | 4.8mA | |
| Current - Output / Channel | 260mA | |
| Voltage - Supply, Single/Dual (±) | 10 V ~ 30 V, ±5 V ~ 15 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad | |
| Supplier Device Package | 8-MSOP-PowerPad | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | THS3111IDGN | |
| Related Links | THS31, THS3111IDGN Datasheet, Texas Instruments Distributor | |
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