Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TMX5701227BZWTQQ1 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-R4F | |
| Core Size | 16/32-Bit | |
| Speed | 180MHz | |
| Connectivity | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, MibSPI, SPI, UCI, UART/USART | |
| Peripherals | DMA, POR, PWM, WDT | |
| Number of I/O | 101 | |
| Program Memory Size | 1.25MB (1.25M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 64K x 8 | |
| RAM Size | 192K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.14 V ~ 3.6 V | |
| Data Converters | A/D 24x12b | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 337-LFBGA | |
| Supplier Device Package | 337-NFBGA (16x16) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TMX5701227BZWTQQ1 | |
| Related Links | TMX57012, TMX5701227BZWTQQ1 Datasheet, Texas Instruments Distributor | |
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