Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-TWL6032A2B7YFFR | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 3,000 | |
Category | Integrated Circuits (ICs) | |
Family | PMIC - Power Management - Specialized | |
Series | - | |
Packaging | Tape & Reel (TR) | |
Applications | Handheld/Mobile Devices, OMAP™ | |
Current - Supply | 20µA | |
Voltage - Supply | 2.5 V ~ 4.8 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 155-UFBGA, DSBGA | |
Supplier Device Package | 155-DSBGA (5.21x5.36) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | TWL6032A2B7YFFR | |
Related Links | TWL6032, TWL6032A2B7YFFR Datasheet, Texas Instruments Distributor |
![]() | 19164-0020 | CONN RING SEALABLE 3/8 14-16AWG | datasheet.pdf | |
![]() | 1582430000 | CB 1.6E 18-16 TIN I 3.5 250/BX | datasheet.pdf | |
![]() | 1030300000 | TERM BLOCK 35MM DIN MULTLEVEL BG | datasheet.pdf | |
AGL125V2-FG144 | IC FPGA 97 I/O 144FBGA | datasheet.pdf | ||
![]() | PIC32MX230F064B-I/SP | IC MCU 32BIT 64KB FLASH 28SDIP | datasheet.pdf | |
![]() | RNC55H6041FPR36 | RES 6.04K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 0216.800VXP | FUSE CERAMIC 800MA 250VAC 5X20MM | datasheet.pdf | |
![]() | 142-1701-201 | CONN SMA JACK STR 50 OHM SOLDER | datasheet.pdf | |
![]() | 1906268 | TERM BLOCK PCB | datasheet.pdf | |
![]() | ATS-16B-114-C2-R0 | HEATSINK 40X40X15MM XCUT T766 | datasheet.pdf | |
![]() | KSZ8091RNBIA-TR | TXRX PHY 10/100 3.3V 32MLF | datasheet.pdf | |
![]() | VJ0402D120KXBAJ | CAP CER 12PF 100V NP0 0402 | datasheet.pdf |