Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-UPD70F3825GB-GAH-AX | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | V850ES/Jx3-H | |
| Packaging | Tray | |
| Core Processor | V850ES | |
| Core Size | 32-Bit | |
| Speed | 48MHz | |
| Connectivity | CAN, CSI, EBI/EMI, I²C, UART/USART, USB | |
| Peripherals | DMA, LVD, PWM, WDT | |
| Number of I/O | 45 | |
| Program Memory Size | 256KB (256K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 24K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.85 V ~ 3.6 V | |
| Data Converters | A/D 10x10b; D/A 1x8b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-LQFP | |
| Supplier Device Package | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | UPD70F3825GB-GAH-AX | |
| Related Links | UPD70F382, UPD70F3825GB-GAH-AX Datasheet, Renesas Electronics America Distributor | |
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