Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-VJ0805D130GXPAP | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 10,000 | |
Category | Capacitors | |
Family | Ceramic Capacitors | |
Series | VJ HIFREQ | |
Packaging | Tape & Reel (TR) | |
Capacitance | 13pF | |
Tolerance | ±2% | |
Voltage - Rated | 250V | |
Temperature Coefficient | C0G, NP0 | |
Mounting Type | Surface Mount, MLCC | |
Operating Temperature | -55°C ~ 125°C | |
Applications | RF, Microwave, High Frequency | |
Ratings | - | |
Package / Case | 0805 (2012 Metric) | |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
Height - Seated (Max) | - | |
Thickness (Max) | 0.057" (1.45mm) | |
Lead Spacing | - | |
Features | High Q, Low Loss | |
Lead Style | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | VJ0805D130GXPAP | |
Related Links | VJ0805D, VJ0805D130GXPAP Datasheet, Vishay/Vitramon Distributor |
![]() | 20-101-0357 | COMPUTER SINGLE-BOARD BL1810 | datasheet.pdf | |
![]() | RG1005P-3571-B-T5 | RES SMD 3.57KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | AMM12DSXN | CONN EDGECARD 24POS DIP .156 SLD | datasheet.pdf | |
![]() | SI4737-B-EVB | BOARD EVAL SI4737 VERSION B | datasheet.pdf | |
![]() | 2-962349-1 | 6P STIFT-GEH 3MM | datasheet.pdf | |
M1AGL600V2-FG144 | IC FPGA 97 I/O 144FBGA | datasheet.pdf | ||
![]() | RN50E1322BB14 | RES 13.2K OHM 1/20W .1% AXIAL | datasheet.pdf | |
![]() | 6408 SL002 | MULTI-PAIR 20COND 24AWG 500' | datasheet.pdf | |
![]() | 1N5923CPE3/TR8 | DIODE ZENER 8.2V 1.5W DO204AL | datasheet.pdf | |
![]() | DF12D(4.0)-30DP-0.5V(80) | CONN HEADER 30POS 4MM SMD 0.5MM | datasheet.pdf | |
![]() | 1PMT4109CE3/TR7 | DIODE ZENER 15V 1W DO216 | datasheet.pdf | |
![]() | 11300245422 | HAN B PROTECT COVER DIE CAPC (EA | datasheet.pdf |