Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-VJ0805D6R8CXAAJ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Capacitors | |
| Family | Ceramic Capacitors | |
| Series | VJ HIFREQ | |
| Packaging | Tape & Reel (TR) | |
| Capacitance | 6.8pF | |
| Tolerance | ±0.25pF | |
| Voltage - Rated | 50V | |
| Temperature Coefficient | C0G, NP0 | |
| Mounting Type | Surface Mount, MLCC | |
| Operating Temperature | -55°C ~ 125°C | |
| Applications | RF, Microwave, High Frequency | |
| Ratings | - | |
| Package / Case | 0805 (2012 Metric) | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height - Seated (Max) | - | |
| Thickness (Max) | 0.057" (1.45mm) | |
| Lead Spacing | - | |
| Features | High Q, Low Loss | |
| Lead Style | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | VJ0805D6R8CXAAJ | |
| Related Links | VJ0805D, VJ0805D6R8CXAAJ Datasheet, Vishay/Vitramon Distributor | |
![]() | CT6EW502 | TRIMMER 5K OHM 0.5W TH | datasheet.pdf | |
![]() | NB2309AC1D | IC BUFFER CLK 9OUT 3.3V 16-SOIC | datasheet.pdf | |
![]() | 68405-172H | BERGSTIK II DR R/A WIDE BODY | datasheet.pdf | |
![]() | SSTUB32S868CHLF | IC REGIST BUFF 25BIT DDR2 176BGA | datasheet.pdf | |
![]() | MAX98400AETX+ | IC AMP AUDIO STEREO D 36TQFN | datasheet.pdf | |
![]() | DTS24F17-8PB-LC | CONN HSG RCPT JAM NUT 8POS PIN | datasheet.pdf | |
![]() | E112MYCQE | SWITCH PUSHBUTTON SPDT 4A 125V | datasheet.pdf | |
![]() | 8N4SV75FC-0094CDI8 | IC OSC VCXO 20MHZ 6-CLCC | datasheet.pdf | |
![]() | IALHK111-1REC4R-40432-R5 | CIR BRKR MAG-HYDR LEVER | datasheet.pdf | |
![]() | 416F32025IDT | CRYSTAL 32.000 MHZ 18PF SMT | datasheet.pdf | |
![]() | 97-3108B18-20PW | AB 5C 5#16 PIN PLUG | datasheet.pdf | |
![]() | EP7312-CR-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |