Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W25Q32DWSFIG | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | W25Q32DW Devices 04/Sep/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 44 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | SpiFlash® | |
| Packaging | Tube | |
| Format - Memory | FLASH | |
| Memory Type | FLASH | |
| Memory Size | 32M (4M x 8) | |
| Speed | 104MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 16-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W25Q32DWSFIG | |
| Related Links | W25Q32, W25Q32DWSFIG Datasheet, Winbond Electronics Corp. Distributor | |
![]() | IXSH35N120B | IGBT 1200V 70A 300W TO247 | datasheet.pdf | |
![]() | 7-1623932-3 | RES 2.40K OHM 1/2W 5% AXIAL | datasheet.pdf | |
![]() | 403I35D25M00000 | Crystal 25.0000MHz 30ppm 18pF 60 Ohm -40°C - 85°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
![]() | VE-J31-CZ-B1 | CONVERTER MOD DC/DC 12V 25W | datasheet.pdf | |
![]() | 0011185173 | INSULATION PUNCH | datasheet.pdf | |
![]() | RC0201JR-0718RL | RES SMD 18 OHM 5% 1/20W 0201 | datasheet.pdf | |
![]() | 0801661 | CONN SEALING FRAME WITH LATCH | datasheet.pdf | |
![]() | ACC24DTKI | CONN EDGECARD 48POS .100" | datasheet.pdf | |
![]() | VJ0805D130JLCAP | CAP CER 13PF 200V NP0 0805 | datasheet.pdf | |
![]() | 567296-3 | HDM 5SMPR033F055O G | datasheet.pdf | |
![]() | MKP386M547085YT7 | MKP 4.7UF 5% 850VDC DRAWING T7 | datasheet.pdf | |
![]() | AIB1FC18-11SC | GT 5C 5#12 SKT RECP LINE | datasheet.pdf |